Oct 18— India’s first commercially packaged multi-chip module (MCM) has rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand and been delivered to California-based Alpha & Omega Semiconductor (AOS).
About 900 intelligent power modules (IPMs) were dispatched to AOS, a Sunnyvale-headquartered designer and supplier of power semiconductors. The Sanand OSAT, set up under India Semiconductor Mission 1.0 (ISM), has received ₹1,653.5 crore support from the Centre.
Kaynes said pilot-line manufacturing began in April, culminating in Wednesday’s shipment. “This is a one-of-its-kind module with 17 dies inside—six IGBTs, two controller ICs, six fast-recovery diodes and three diodes—placing it among the most advanced in this domain,” said Raghu Panicker, CEO, Kaynes Semicon, noting that Infineon remains a market leader in the segment. “Companies generally think of single-die packaging; we delivered a multi-chip module. We’ve assembled, tested, marked and packaged the device for AOS at Sanand. Current capacity is 3,000 pieces per day, with another shipment due next month.”
An IPM integrates power-switching elements (such as IGBTs) with drive and protection circuitry in a compact package, simplifying motor control and other high-power applications. Moving from single-die to multi-die (chiplet) packaging allows designers to mix processes and technologies, improving yields, modularity, time-to-market and performance.
“This shows Kaynes is not taking baby steps with basic packaging but jumping to commercially ship complex, highly integrated modules using advanced packaging, assembly and testing,” said Neil Shah, partner at Counterpoint Research. IPMs, he added, serve high-reliability use-cases from electric vehicles to renewable energy, where safety and durability are critical. “Scaling beyond one product and one customer—maintaining yields, quality and efficiency—will be the next test,” he said.
Kaynes plans to build Sanand into a regional hub for the C-to-A (chip-to-application) value chain, spanning local production, supply-chain partnerships and MRO (maintenance, repair and overhaul). The facility is designed to reach a total capacity of 6.3 million chips per day when fully operational. For AOS specifically, this shipment marks the start of commercial production, with mass production targeted for January 2026. AOS is expected to utilise most initial capacity, with output ramping to ~1.5 million chips per day by Q1 FY2026-27. Under the agreement, Kaynes will supply 10 million chips annually to AOS for five years.
The ₹3,307 crore OSAT project is being funded 50% by the Centre (₹1,653.5 crore), 20% by the Gujarat government (₹661.4 crore), and the balance ₹992.1 crore by the company. Kaynes has so far committed about ₹400 crore to the facility.
Mysuru-headquartered Kaynes Technology (founded 1988) is a listed electronics manufacturing services firm with design-led manufacturing, IoT and integrated systems capabilities. Its semiconductor arm, Kaynes Semicon, is a key pillar of the company’s push to align with India’s semiconductor mission.
